Automated optical inspection. AOI systems are automated systems fitted with imaging technology that are able to identify faults. They are used to visually inspect manufactured PCBs and electronic components.
A test to check digital and analogue modules in electronics.
Operating the circuit in the factory with a power supply that is at an elevated temperature. The burn-in phase is known for relatively high fault rates but they fall again quickly.
A test to pre-age electronic parts.
Also known as a printed circuit board (PCB). It is used to wirelessly connect electronic components.
Electronics manufacturing services. Developing and manufacturing electronic modules and equipment.
Electrostatic discharge. This puts electronic components at risk. ESD protection is thus essential and is needed for workstations, tools, packaging, device parts, etc.
Fachverband für Design, Leiterplatten- und Elektronikfertigung (the Professional Association for Design, PCB and Electronics Manufacturing).
Institute for Printed Circuits. An internationally renowned publisher of regulations for PCBs and electronic circuits.
A compilation of requirements for environmental management systems.
A compilation of requirements for quality management systems. Used as a basis for certifying quality management systems.
A flexible method of inventory maintenance and production control in keeping with the pull principle. It focuses solely on the consumption of materials in the manufacturing process and enables a sustainable reduction in the stock levels of certain semi-finished products. The core element is the self-regulating control systems at workflow level.
Light-emitting diode. An energy-saving light source with a very long life cycle.
A particularly small logic and control unit (μ= micro).
Printed circuit board, also known as a printed wiring board (PWB). Another name for a circuit board.
Surface-mount device. Surface-mounted parts that are directly soldered onto a PCB using solderable terminal areas.
Surface-mount technology. Soldering elements directly onto the PCB enables a more compact component assembly on both sides of the circuit board.
Through-hole device. Wired parts.
Through-hole technology. An assembly method in which the wired parts (THDs) are inserted into through holes in the PCB and soldered.
A soldering method performed in an inert gas atmosphere. The use of nitrogen counteracts the adverse effects of oxygen.
X-ray inspection system. Is used to analyse hidden soldering, e.g. in QFP, BGA, CSP, FC and for process control. Pore formation, wetting, the amount of solder, short circuiting or breaks can also be automatically detected.