Contact

HEKATRON Technik GmbH
Brühlmatten 3a-9
79295 Sulzburg

Fax: +49 7634 500-316
ems@hekatron.de

Searched for "aoi".Found 4 results in 1 milliseconds.Displaying results 1 to 4 of 4.
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  1. Automated Optical Inspections
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    Automated Optical Inspections We keep an eye on every possible fault. After the assembly and the soldering process, our AOI systems once again check the PCBs in the automated optical inspection. This process enables us to reliably detect missing or incorrect components, insufficient soldering and incorrect polarities. Flawless PCBs can continue to the next stage of the process. Faulty modules can be corrected by a professional until everything is perfect. Back to overview

  2. SMT Assembly
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    SMT ASSEMBLY Maximum precision and reliability. 100% automated. In surface mount technology (SMT) assembly, our pick-and-place machines connect the surface mount devices (SMDs) to the PCB. The module is then heated and thus soldered in one of our reflow (convection or vapour-phase) soldering ovens. We can also manufacture parts for you on pure SMT circuit boards or even together with wired through-hole technology (THT) components. SMT assembly at Hekatron Fully automatic solder paste printing Adhesive and solder paste dispensing Single/double-sided SMD assembly on 5 SMD lines (SIPLACE SX-/X-Series) SMD and THR assembly Reflow convection soldering using nitrogen or vapour-phase soldering In-line automated optical inspection (AOI) Back to overview

  3. Glossary
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    GLOSSARY The most important terms with a brief explanation. So you always know what we are talking about. AOI Automated optical inspection. AOI systems are automated systems fitted with imaging technology that are able to identify faults. They are used to visually inspect manufactured PCBs and electronic components. Boundary scan A test to check digital and analogue modules in electronics. Burn-in Operating the circuit in the factory with a power supply that is at an elevated temperature. The burn-in phase is known for relatively high fault rates but they fall again quickly. Burn-in-test A test to pre-age electronic parts. Circuit board Also known as a printed circuit board (PCB). It is used to wirelessly connect electronic components. EMS Electronics manufacturing services. Developing and manufacturing electronic modules and equipment. ESD Electrostatic discharge. This puts electronic components at risk. ESD protection is thus essential and is needed for workstations, tools, packaging, device parts, etc. FED Fachverband für Design, Leiterplatten- und Elektronikfertigung (the Professional Association for Design, PCB and Electronics Manufacturing). IPC Institute for Printed Circuits. An internationally renowned publisher of regulations for PCBs and electronic circuits. ISO 14001:1996 A compilation of requirements for environmental management systems. ISO 9001:2000 A compilation of requirements for quality management systems. Used as a basis for certifying quality management systems. Kanban A flexible method of inventory maintenance and production control in keeping with the pull principle. It focuses solely on the consumption of materials in the manufacturing process and enables a sustainable reduction in the stock levels of certain semi-finished products. The core element is the self-regulating control systems at workflow level. LED Light-emitting diode. An energy-saving light source with a very long life cycle. Microcontroller A particularly small logic and control unit (μ= micro). PCB Printed circuit board, also known as a printed wiring board (PWB). Another name for a circuit board. SMD Surface-mount device. Surface-mounted parts that are directly soldered onto a PCB using solderable terminal areas. SMT Surface-mount technology. Soldering elements directly onto the PCB enables a more compact component assembly on both sides of the circuit board. THD Through-hole device. Wired parts. THT Through-hole technology. An assembly method in which the wired parts (THDs) are inserted into through holes in the PCB and soldered. Wave soldering A soldering method performed in an inert gas atmosphere. The use of nitrogen counteracts the adverse effects of oxygen. X-ray X-ray inspection system. Is used to analyse hidden soldering, e.g. in QFP, BGA, CSP, FC and for process control. Pore formation, wetting, the amount of solder, short circuiting or breaks can also be automatically detected.

  4. Tests and Inspections
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    TESTS AND INSPECTIONS PLAY IT SAFE. WITH HEKATRON. Your products’ quality and reliable functionality are not just important, they are essential. So we offer a broad spectrum of tests and inspections and let you decide which ones are most important to your products. As each product differs, we also develop individual concepts and test equipment for you. And thus guarantee maximum manufacturing quality. Tests and inspections at Hekatron 5 AOI systems (3D inspection) In-circuit tests (ICT) Functional testing (FT) Safety tests (high-voltage test, SL test, etc.) Boundary scan X-ray Environmental tests Developing test equipment at Hekatron Consultation at the PCB design-for-test stage Developing test programmes Constructing the testing equipment AUTOMATED OPTICAL INSPECTION We keep an eye on every possible fault. more information IN-CIRCUIT TEST We track down each individual fault. more information   FUNCTIONAL TESTING Nothing beats a test run in real conditions. more information   SAFETY TESTS We ensure operational safety. And tailor it to all requirements. more information   BOUNDARY SCAN TEST Gets to places that other tests simply can’t reach. more information   X-RAY We even track down invisible defects. more information   ENVIRONMENTAL TEST AND BURN-IN TEST Testing in extreme conditions. Our way of preventing early failure. more information